國立虎尾科技大學材料科學與工程系

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T.K.Tsai*, C.C.Chuang, C.C.Chao, and W.L.Liu, “Growth and field emission of carbon nanofibers on electroless Ni-P alloy catalyst ” Diamond and Related Materials 12 (2003) 1453-1459

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T.K.Tsai*, C.C.Chao,“The growth morphology and crystallinity of electroless NiP deposition on silicon”Applied Surface Science 233 (2004) 180-190

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W.L.Liu, S.H.Hsieh*, T.K.Tsai, and  W.J.Chen,“ Growth kinetics of electroless cobalt deposition by TEM” Journal of The Electrochemical Society 151（2004）C680-C683

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C.M.Liu, W.L.Liu, S.H.Hsieh, T.K.Tsai and W.J.Chen*, “Interfacial reactions of electroless nickel thin films on silicon” Applied Surface Science 243(2005) 259-264

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C.M.Liu, W.L.Liu, W.J.Chen*, S.H.Hsieh, T.K.Tsai and L.C. Yang,“ITO as a diffusion barrier between Si and Cu” Journal of The Electrochemical Society 152(2005) G234-239.

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W. L. Liu, S. H. Hsieh, T. K. Tsai*, W. J. Chen, S. S. Wu, “Temperature and pH dependence of the electroless Ni-P deposition on silicon” Thin Solid Film 510 (2006) 102-106

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W. L. Liu, W. J. Chen*, T. K. Tsai, H. H. Tsai,S. H. Hsieh,”Interface structure between epitaxial NiSi2 and Si” Journal of University of Science and Technology Beijing 13 (2006) 558-563

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W.L.Liu, W.J.Chen*, T.K.Tsai, S.H.Hsieh, and C.M.Liu, “Effct of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper”  Thin Solid Film 515 (2006) 2387-2392

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W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen “Deposition of electroless Ni on micro-sized acrylic spheres” Journal of Materials Science 42(2007) 2121-2125

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S. S. Wu, W. L. Liu, T. K. Tsai*, S. H. Hsieh, W. J. Chen, “Growth behavior of electroless copper on silicon substrate” Journal of University of Science and Technology Beijing 14 (2007) 67-71

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W. L. Liu, S. H. Hsieh,S. J. Hwang, T. K. Tsai, W. J. Chen, “Tribological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication” Journal of University of Science and Technology Beijing 14 (2007) 167-172

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W.L.Liu, W.J.Chen, T.K.Tsai, S.H.Hsieh, and C.M.Liu, “Effct of tin-doped indium oxide film as capping layer on the agglomeration of copper film and the appearance of copper silicide” Applied Surface Science 253(2007) 5516-5520

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W. J. Chen, W. L. Liu, S. H. Hsieh, T. K. Tsai, “Preparation of nanosized ZnO using αbrass” Applied Surface Science, 253(16), 15June 2007, 6749-6753.

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W.L.Liu, W.J.Chen, T.K.Tsai, S.H.Hsieh, and S. Y. Chang, “Effct of nickel on the initial growth behavior of electroless Ni-Co-P alloy on silicon substrate” Applied Surface Science 253(2007) 3843-3848

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T. K. Tsai *, S. S. Wu, W. L. Liu , S. H. Hsieh , W. J. Chen, “Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon” Journal of Electronic Materials, v.36, n.11(2007) p1408-1414.

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T. K. Tsai *, S. S. Wu, C. S. Hsu, J.S. Fang,〝Effect of Phosphorus in Electroless CoWP film on the Diffusion Barrier between Electroless Copper and Silicon〞 submitted in Thin Solid Films 2008

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蔡定侃, 朝春光 ” 鐵基複合材料之陶瓷強化材表面改質之研究 “ 2000年材料年會

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T.K.Tsai, W.L.Liu, S.H.Hsieh, and Wen-Jauch Chen, “ Growth of carbon nanotubes on electroless Ni-P alloy catalyst ” 2002 MRS Fall Meeting.

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W.L.Liu, T.K.Tsai, S.H.Hsieh, W.J.Chen, “Effect of phosphorus on the nickel silicide formation “ 2002年材料年會

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謝淑惠, 劉偉隆, 蔡定侃, 陳文照, 江正輝, 江振貴 “The study of growth kinetics of electroless cobalt deposition by transmission electron microscope” 2002材料年會

5

T.K.Tsai, W.L.Liu, S.H.Hsieh, Wen-Jauch Chen, and H.S.Wu, “The growth morphology and mechanism of electroless NiP deposition on silicon” 2004年材料年會

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T.K.Tsai, W.L.Liu, S.H.Hsieh,and Y.Q.Yao, “The study of the SnO2 thin film for gas senser using the electroless plating technology” 2004年材料年會

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W.L. Liu , S.H. Hsieh, T. K. Tsai, and W.J. Chen, “A Method for Mass Production of Carbon Nanofibers by Thermal Chemical Vapor Deposition,” The 3rd Asian Conference on Chemical Vapor Deposition, Taipei, Taiwan, November 2004

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劉偉隆，陳文照，張淑怡，蔡定侃，謝淑惠，’鎳對無電鍍鈷薄膜成長之影響’， 中國材料年會，11月25-26日，淡江大學，2005

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陳文照、江松懋、劉偉隆、蔡定侃、謝淑惠，’奈米碳管於燃料電池應用之研究’，中國機械工程學會第二十二屆全國學術研討會論文集，11月25-26日，中央大學，2005

10

W. L. Liu, W. J. Chen, S. H. Hsieh, T. K. Tsai, and C. M. Liu, “Effect of Tin-doped Indium oxide film thickness on the Diffusion Barrier between Silicon and Copper” 209th Meeting of The Electrochemical Society, Denver, Colorado, U.S.A., May, 2006

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W. L. Liu, W. J. Chen, S. H. Hsieh, and T. K. Tsai, “A Capillary Electrophoresis Chip for Rhodamine B and Inorganic Ion detection Utilizing Contactless Capacitance Detection” Nanotech 2006, Boston, Massachusetts, U.S.A., May.

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吳信賢，蔡定侃，劉偉隆，謝淑惠，陳文照，”以無電鍍方式製備鈷合金薄膜作為擴散阻障層之研究” 中國材料年會，11月25-26日，成功大學，2006

13

吳信賢，蔡定侃，劉偉隆，謝淑惠，陳文照，”The intial deposition behavior of electroless copper deposition on silicon” 中國材料年會，11月25-26日，成功大學，2006

14

T. K. Tsai *, S. S. Wu , W. L. Liu , S. H. Hsieh , W. J. Chen ”Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon” TMS 2007, Orlando, Florida, U.S.A. 25/2-1/3 March.

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W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen, “The effect of CNTs on the growth and particle sizes of TiO₂ on nano-composite TiO₂/CNTs ”, 4^th International Conference on Materials for Advanced Technologies, 1-6 July 2007, Singapore.

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蔡定侃，吳信賢，劉偉隆，謝淑惠，陳文照，”The effect of the electroless CoWP film thickness on diffusion barrier properties” 中國材料年會，11月16-17日，交通大學，2007

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許哲源，蔡定侃，劉偉隆，謝淑惠，陳文照，”無電鍍複合鍍製備太陽能選擇性吸收膜之性質探討” 中國材料年會，11月16-17日，交通大學，2007

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蔡定侃，李景恆，許哲源，江安洲，〝Al₂O₃對Ni-Al₂O₃太陽能選擇性複合吸收膜之性質影響〞2008中國顆粒學會年會暨海峽兩岸顆粒技術研討會，上海

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T. K. Tsai, H.C. Chen, J. H. Lee, J. S. Fang,”High conductivity Indium Zinc Oxide prepared by Reavtive Magnetron Co-sputtering Technique from Indium and Zinc Metallic Target” THIN FILMS 2008,13-16, july, 2008, Singapore

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許哲源，蔡定侃〝無電鍍複合鍍製備Ni-Al₂O₃太陽能選擇性複合吸收膜之性質探討〞2008 材料年會，台北

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江安洲，林俊仁，許哲源，蔡定侃〝無電鍍複合鍍製備太陽能選擇性黑鎳吸收膜〞2008 材料年會，台北

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T. K. Tsai *, J. H. Lee, S. S. Wu, J.S. Fang, \"Failure behavior of electroless CoWP film as a diffusion barrier between electroless Cu and Si\"  2009 TMS Annual Meeting & Exhibition, February 15-19, 2009 , San Francisco, California, USA

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W. H. Luo, T. K. Tsai, J. S. Fang, \" Ehancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition\"  2009 TMS Annua l Meeting & Exhibition, February 15-19, 2009 , San Francisco, California, USA

1

\{{data_intro_title}}quot;含有FE-NI奈米粒子之粉體及其製造方法\{{data_intro_title}}quot;專利號碼: US 7, 247,376 B1專利期間: 2004.06.17~2024.06.17