Department of Materials Engineering and Science, National Gormosa University

Major Education

Master, Graduate Institute of Mechanical Engineering National Taiwan University of Science and Technology Materials Division

Bachelor, Department of Mechanical Engineering Technology, Feng Chia University

Specialties and Research Areas

Thin Film Technology / Materials Analysis / Semiconductor Processes

1

C.S. Hsu , S.T. Chen , Y.H. Hsieh , G.S. Chen “Growth of ultrathin barrier layers with sub-5-nm metallic seeds fabricated by sequential treatments of vacuum plasma and electrochemical solution”Vacuum 83 (2009) 708–710

2

C.S. Hsu , S.T. Chen , Y.S. Tang , G.S. Chen  “ Strengthening electroless Co-based barrier layers by minor refractory-metal doping”Thin Solid Films 517 (2008) 1274–1278

3

C.S. Hsu, H.Y. Hsieh ,J.S. Fang,, “Enhancement of Oxidation Resistance and Electrical Propertiesof Indium-Doped Copper Thin Films”Journal of Electronic Materials, Vol. 37, No. 6, pp.852-859 (2008)

4

J.S. Fang,, T.P. Hsu, M.L. Ker, H.C. Chen, J.H. Lee, C.S. Hsu, L.C. Yang “Evaluation of properties of Ta–Ni amorphous thin film for copper metallization in integrated circuits”Journal of Physics and Chemistry of Solids 69 (2008) 430–434

5

Kuan-Hong Lin, Chen-Siang Hsu , Shun-Tian Lin, “Microstructures of W-Mo-Ni-Fe Heavy Alloys”, Materials Science Forum   vol.534-536, pp. 1273-1276         (2007)

6

Feng-Tsai. Weng, Chen-Siang Hsu, Wen-Feng Lin“Fabrication of micro components to Silicon wafer using EDM process” Materials Science Forum. Vol.505,pp217-222 (2006)

7

L.C.Yang, C.S.Hsu, G.S.Chen, C.C.Fu, J.M.Zuo and B.Q.Lee, “Strengthening TiN diffusion barriers for Cu metallization by lightly doping Al ”, Applied Physics Letters, 87(12), Art.No.12191(2005) (SCI, EI)

8

G.S. Chen, L.C. Yang, H.S. Tian and C.S. Hsu “Evaluating substrate bias on the phase-forming behavior of tungsten thin films deposited by diode and ionized magnetron sputtering” Thin Solid Films, Vol. 484, pp.83-89 (2005). (SCI,)

9

Chen-Siang Hsu, Kuan-Hong Lin and Shun-Tian Lin,“Precipitation mechanisms of intermetallic compounds in W–Mo–Ni–Fe alloys” Inter. Journal of Refractory Metals and Hard Materials,Vol.23, pp.175-182(2005). (SCI, EI)

10

Jau-Shiung Fang, Li-Chung Yang, Chen-Siang Hsu, Gin-Shiang Chen, Yen-Wei Lin and Giin-Shan Chen(2005)“Phase transition behavior of reactive sputtering deposited Co–N thin films using transmission electron microscopy” J. Vac. Sci. Tech. A, 22(3) pp.698-704 (2004).

11

Feng-Tsai Weng, R. F. Shyu, Chen-Siang Hsu, “Fabrication of micro electrodes by multi-EDM grinding process”. Journal of Materials processing Technology. . Vol.140, pp.332-334(2003). (SCI). NSC90-2218-E-150-008.

12

府玠辰、黃獻慶、許振聲、許禎祥、陳錦山， “組成調制氮化鉭超薄擴散阻礙層銅金屬化系統之特性評估” 真空科技, 15(1), pp.40-45. (2002)

1

J. S. Fang, T.P. Hsu, C.S. Hsu and G.S. Chen, ” Crystallization and failure behaviors of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization” Annual Conference of the Chinese Society for Material Science. PB1-56 (2004)

2

     T.H. Hsu, S.C. Zhang, P.J. Chen, B.Y. Chen, T.P. Hsu, C.S. Hsu and J.S. Fang, “ Diffusion barrier properties of amorphous Ta-Co thin film for copper metalization”, Annual Conference of the Chinese Society for Material Science. PB1-55 (2004)

3

     C.M. Zheng, S.H. Zend, J.Y. Zhang, J.L. Zhang, J.W. Lin, Y.R. Li, T.P. Hsu, C.S. Hsu and J.S. Fang, “Diffusion barrier characteristics of amorphous Ta50Fe50 thin film prepared by a DC sputtering method”, Annual Conference of the Chinese Society for Material Science. PB1-54  (2004)

4

Feng-Tsai Weng, Chen-Siang Hsu,  R.F. Shyu., “Manufacturing of micro electrodes Using Ultra Sonic Aided Electrochemical machining”Design, Test, Integration and Packaging of MEMS/MOEMS, France,  pp.399-401 0505-0507 (2003).

5

府玠辰、許振聲、許禎祥、陳錦山， “組成調制氮化鉭超薄擴散阻礙層於低溫與高溫銅金屬化系統特性評估” Annual Conference of the Chinese Society for Material Science.. 08-42 (2001)

1

陳長有、許禎祥、許振聲、陳伯宜，『機械材料實驗』，全華科技圖公司，台北，(2007)。